The Surface Preparation and Cleaning Conference (SPCC)

semiconductor waferThe Surface Preparation and Cleaning Conference (SPCC) is an annual event which brings together prominent researchers from the semiconductor industry and the university community to focus on developments and challenges in advanced wafer and mask cleaning and surface preparation technologies.

Join industry experts from around the globe representing IC manufacturers, suppliers, and research organizations to present and discuss the industry’s best available data on wafer, mask and part cleaning technologies and solutions:

  • Wafer front-end
  • Wafer back-end
  • Post CMP
  • Packaging
  • Advanced mask
  • Equipment and parts
  • Environment, safety and health issues

Introducing Post CMP Cleaning Conference

The Post CMP Cleaning Conference is a complementary conference to the Surface Preparation and Cleaning Conference, where invited speakers will review process trends, material developments, and equipment innovation in the specialized area of post CMP cleaning.

Conference Details


Post CMP: Monday, March 27, 2017
SPCC: Tuesday, March 28 and Wednesday March 29, 2017

AT&T Executive Conference Center, Austin, Texas

SPCC 2017 Sponsors
Levitronix logo Elemental Scientific logo
Asahi-Logo-sm KMG Chemicals logo

SPCC 2017 Media Partner is Global Water Intelligence

MAY 31 – JUNE 1, Hilton Portland & Executive Tower, Portland, OR