The Surface Preparation and Cleaning Conference (SPCC)

semiconductor waferThe Surface Preparation and Cleaning Conference (SPCC) is an annual event which brings together prominent researchers from the semiconductor industry and the university community to focus on developments and challenges in advanced wafer and mask cleaning and surface preparation technologies.

Join industry experts from around the globe representing IC manufacturers, suppliers, and research organizations to present and discuss the industry’s best available data on wafer, mask and part cleaning technologies and solutions:

  • Wafer front-end
  • Wafer back-end
  • Post CMP
  • Packaging
  • Advanced mask
  • Equipment and parts
  • Environment, safety and health issues

Introducing Post CMP Cleaning Conference

The Post CMP Cleaning Conference is a complementary conference to the Surface Preparation and Cleaning Conference, where invited speakers will review process trends, material developments, and equipment innovation in the specialized area of post CMP cleaning.

Registration is Open

Register by March 3 and Save!
Register for the complete conference by March 3 and get the Post CMP Cleaning Conference for only $100.

Register Now 

Conference Details


Post CMP: Monday, March 27, 2017
SPCC: Tuesday, March 28 and Wednesday March 29, 2017

AT&T Executive Conference Center, Austin, Texas

Help Support the SPCC

Learn more about sponsorship opportunities. Call Mark Thirsk at 617-273-8837.

SPCC 2017 Sponsors