The cleaning of wafers after CMP is a special case in the area of wafer cleaning technologies. Not only are particles intentionally introduced into the process, the environment at the wafer surface is tightly controlled during and after the cleaning process. Additionally, the surface of the wafer is non-homogeneous and highly reactive, and the surface chemistry must be controlled as the clean surface is dried. Any cleaning process is likely to be carried out with the same cycle time as the CMP process, adding further technical constraints.
The Post CMP Cleaning Conference is designed to be a complementary conference to the Surface Preparation and Cleaning Conference, where invited speakers will review process trends, material developments, and equipment innovation in the specialized area of post CMP cleaning.
The conference will consist of three primary sessions:
Session 1: Market Trends
Session 2: Materials & Process Trends
Session 3: Equipment & Process Trends
The conference will start Monday, March 27 at 10 AM and conclude at approximately 5 PM. Lunch will be provided, as well as afternoon refreshments. Attendees registered for SPCC will be invited to drinks and hors d’oeuvres on Monday evening.
The conference will take place at the AT&T Executive Conference Center in Austin, Texas. We have secured a limited number of rooms at the conference center hotel, and attendees will be offered a special rate if rooms are still available.
Price for attendees is $250. For attendees registering for both the post CMP conference and SPCC will receive a discount of $100 on total registration costs.